The bimetallic copper aluminum plate of Henan Chalco is produced by the cold-rolling composite method. During the rolling process, only mechanical bonding is achieved, and subsequent diffusion heat treatment is required to achieve the purpose of metallurgical bonding. In the process of diffusion heat treatment, the interface The inter-diffusion of elements will form a diffusion interface layer, accompanied by the production of intermetallic compounds. This interface layer structure will have an important impact on the bonding strength, mechanical properties, thermal conductivity, and electrical properties of the composite board.
Aiming at the bimetallic copper aluminum plate with a relatively large thickness, it is produced by explosive compounding method. It uses explosives as energy source. After the explosives are detonated, they undergo self-acceleration and transform into a stable detonation, and move forward at a certain speed. The layer plate collides with the substrate at a certain angle under the action of the explosion shock wave and the pressure of the detonation product, thereby realizing the metallurgical bonding between the substrate and the multilayer. The composite board produced by this method has high bonding strength and fast speed. For the welding of plates with an area of several square meters, the above process can be completed within a few thousandths of a second.
