With the development of lightweight and miniaturization in electronics, communication and transportation industries, the heat dissipation problem of high energy density is becoming more and more prominent. For example, electric vehicle inverter conversion, PLC chip heat dissipation, high-power LED searchlight all produce huge heat in very small volume. However, the traditional thermal conductive materials such as copper and aluminum are difficult to meet the needs, and the cost of the best thermal conductive and heat dissipation material, silver, is too high to be industrialized.
The Copper clad aluminum plate sheet for radiator substrate developed by Henan Chalco was simulated by numerical simulation. The high-power copper-aluminum composite radiator was fabricated by semi-melting rolling process.
Features: The miniaturization and lightening of energy density can be achieved by distributing the best two metals, namely, high thermal conductivity of copper and high heat dissipation of aluminum.
Product Application: Copper clad aluminum plate sheet for radiator substrate is used in radiators and radiation modules of industrial appliances, LED, PC, new energy vehicles and other industries.
| Thickness | Width | Temper | Bonding strength | Copper ratio | Tensile strength | Elongation | Cladding type |
| 4-15mm | 300--500mm | O/H24 | ≥12N/mm | 10%-25% | 160-260MPa | 10-35% | Overlay cladding |
