CAC lamination plate sheet common application cases
a. When CAC lamination plate sheet is used as a conductive busbar, it only needs to increase the cross-sectional area appropriately to obtain a lighter material at a lower cost. Better than pure copper in areas that are sensitive to weight
b. CAC lamination plate sheet as a material for circuit boards and base station substrates. Due to the high thermal conductivity of the copper layer, it has better performance than pure aluminum, but the density increase is limited, and the structural weight will not be out of control
c. CAC lamination plate sheet can also replace pure copper plate in the decorative field. Due to the lower density and the relatively soft aluminum layer, the ease of processing and installation is better than pure copper. In addition, our metallurgical bonded copper-aluminum composite panel has obvious advantages in weather resistance compared to adhesive composite panels, and will not bulge after wind and rain. In terms of subsequent drawing and ageing, it is only related to the material of the copper layer, and the processing method is exactly the same as that of general copper materials.
d. The partially covered CAC lamination plate sheet can be used as the material for the transition of copper and aluminum connections. Since the mass conductivity of aluminum is higher than that of copper and the volume conductivity is lower than that of copper, aluminum is not easy to weld and copper is expensive, so copper and aluminum materials often have different uses in the field of electrical conductivity. The use of copper-aluminum composite transition plates can effectively reduce the electrochemical corrosion and welding difficulty when connecting copper-aluminum materials.
CAC lamination foil combines the lightness of aluminum with the high thermal conductivity of copper. Chalco Aluminum’s new copper-aluminum composite foil material uses an advanced rolling and heat treatment combined process to achieve metallurgical bonding of copper and aluminum, with minimal interfacial impurities, optimized electrical and thermal conductivity, and high peel strength. The appearance of CAC lamination foil is basically the same as that of copper. The method of use is similar to that of copper, and it can be used for reddening and other operations. Compared with single-layer copper-aluminum composite foil, it can be used as a substitute for copper foil in more occasions.
Specs of CAC lamination foil
| Alloy | Copper clad | Thickness | Width | Roughness |
| T2 1060 5052 | Single side, both sides | 0.03-0.1mm | 100-950 mm | <2um |
Physical property of CAC lamination foil
| Tension strength | Cladding rate | Peel resistance (semi hard) | peel strength | Folding resistance |
| ≥110MPa | 100% | Fracture without delamination | ≥130N·mm/mm | ≥250 times |
