1. Using surface mount technology (SMT);
2. Perform extremely effective treatment of thermal diffusion in the circuit design program;
3. Reduce product operating temperature, improve product power density and reliability, and extend product life;
4. Reduce product volume, reduce hardware and assembly costs;
5. Replace the fragile ceramic substrate to obtain better mechanical durability.
Aluminum Base copper clad laminate CCL’s structure
Aluminum Base copper clad laminate CCL is a metal circuit board material, which is composed of copper foil, thermally conductive insulation layer and metal substrate. Its structure is divided into three layers:
Cireuitl.Layer circuit layer: It is equivalent to the copper clad board of ordinary PCB, and the copper foil thickness of the circuit is loz to 10oz.
Dielcctric Layer Insulation Layer: The insulation layer is a layer of low thermal resistance and thermal insulation material. Thickness: 0.003 "to 0.006" inches is the core calculation of aluminum-based copper clad laminates, and has obtained UL certification.
Base Layer: It is a metal substrate, usually aluminum Aluminum-based copper clad laminate and traditional epoxy glass cloth laminate, etc.
The Aluminum Base copper clad laminate CCL is composed of a circuit layer, a thermally conductive insulating layer and a metal base layer. The circuit layer (ie copper foil) is usually etched to form a printed circuit to connect the various components of the assembly. In general, the circuit layer requires a large current carrying capacity, so a thicker copper foil should be used. 280μm; thermal insulation layer is the core technology of the PCB aluminum substrate. It is generally composed of special polymers filled with special ceramics. It has small thermal resistance, excellent viscoelastic performance, and has the ability to resist thermal aging. . T-101, T-111, T-112, T-113, T-114 and T-200, T-300, T-400, T-500, T-600 and other high-performance PCB aluminum substrate thermal insulation layer This technology is used to make it have excellent thermal conductivity and high-strength electrical insulation performance; the metal base layer is the supporting member of the aluminum substrate, which requires high thermal conductivity. Generally, it is an aluminum plate, and copper plates can also be used. Provide better thermal conductivity), suitable for conventional mechanical processing such as drilling, punching and cutting. PCB material has unparalleled advantages compared with other materials. Suitable for surface mount SMT art of power components. No heat sink is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the good insulation performance and mechanical performance.
Usage of Aluminum Base copper clad laminate CCL
1. Audio equipment: input, output amplifier, balance amplifier, audio amplifier, pre-amplifier, power amplifier, etc.
2. Power supply equipment: switching regulator `DC / AC converter` SW regulator, etc.
3. Communication electronic equipment: high-frequency amplifier `filtering electrical appliances` sending circuit.
4. Office automation equipment: motor driver, etc.
5. Automobile: electronic regulator `igniter` power controller, etc.
